Bulgaria acdc power module potting requirements(1)
●Low technical requirements. Modular power supplies are typically equipped with standardized front ends, highly integrated power modules and other components, thus simplifying power supply design.
●The module power supply shell has a three-in-one structure of heat sink, radiator and shell, which realizes the conduction cooling mode of the module power supply and makes the temperature value of the power supply approach the minimum value. At the same time, the normative packaging of the module power supply is given.
The potting of the acdc power module is very important. This process not only involves the protection of the power module potting acdc power module (waterproof, moisture-proof, dust-proof, anti-corrosion, etc.), but also involves the protection of the power module. thermal design.
Commonly used power module potting materials are divided into three categories: epoxy resin, polyurethane and silicone rubber
Epoxies cannot be used for stress-sensitive and module sealing due to their hardness and are basically eliminated by module power supplies. However, due to its low cost, this epoxy is still used in cost-sensitive micropower supplies. Some domestic bad 48V input power supply manufacturers also use this epoxy resin acdc 48V input power supply module. However, due to stress problems, the failure rate of this 48V input power supply is very high, and buyers are miserable.