Honduras acdc power module potting requirements(2)

A modular power supply is a power supply that can be directly mounted on a printed circuit board and can be used for application-specific integrated circuits (ASICs), digital signal processors (DSPs), microprocessors, memories, field programmable gate arrays (FPGAs) and other Digital or analog loads provide power. Typically, such modules are referred to as load (POL) power supply systems or point-of-use power supply systems (PUPS). Due to the obvious advantages of the modular structure, modular power supplies are widely used in switching equipment, access equipment, mobile communications, microwave communications, optical transmission, routers and other communications fields, as well as automotive electronics, aerospace, etc.

Epoxies cannot be used for stress-sensitive and module sealing due to their hardness and are basically eliminated by module power supplies. However, due to its low cost, this epoxy is still used in cost-sensitive micropower supplies. Some domestic bad 24V input power supply manufacturers also use this epoxy resin acdc 24V input power supply module. However, due to stress problems, the failure rate of this 24V input power supply is very high, and buyers are miserable.

At present, the most commonly used power module is the addition of silicone. This kind of silica gel is generally 1:1, which is easy to operate. When acdc potting power modules, attention should be paid to its thermal conductivity. However, the bonding ability is not very strong, and it can be improved with primer.

Polyurethane has been used in China for a period of time, but due to its high hardness, inconvenient maintenance, and the price reduction of silicone rubber, the cost performance of polyurethane is not high.